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FAQ
- Thin film metrology is the measurement and analysis of thin film thickness, optical constants, and layer uniformity. It uses non-destructive optical methods to verify whether a deposited film matches process specifications, so manufacturers can control coating quality and yield without damaging the sample.
- Offline inspection measures sampled substrates on benchtop equipment in a laboratory, typically for R&D and incoming material checks. Inline inspection is integrated into the production line and scans products automatically at production speed. In-situ inspection is installed inside the vacuum coating chamber and measures film thickness while deposition is running, enabling closed-loop control of the coating process.
- TDM-tek thin film metrology equipment is used in the photovoltaic industry, semiconductor wafer manufacturing, display panels, consumer electronics, food and pharmaceutical packaging, and precision optical components. Any process that deposits a functional coating and needs thickness or uniformity control can apply it.
- TDM-tek uses self-developed algorithms based on spectroscopic ellipsometry, optical interference, X-ray fluorescence (XRF), and laser reflectometry. These methods are non-destructive and support nanometer-level accuracy down to 1 nm, including multilayer composite films and metal, dielectric, and ITO layers.
- Yes. TDM-tek provides custom measurement and control systems designed around a specific process, including equipment selection, production line integration, measurement software, on-site calibration, and lifetime after-sales technical support. Free on-site production line surveys and free sample testing are available before the scheme is finalized.