Film Thickness Measurement Equipment by Model and Range
TDM film thickness equipment spans 4 nm–450 µm micro-area offline measurement, 5–1200 nm multi-parameter and inline measurement, slot-die wet-film monitoring, and wide-band T/R optical-film monitoring. Published ranges and outputs are model-specific.
Start with the Film and Measurement Condition
A useful film-thickness specification must identify the film stack, substrate, expected range, sample dimensions, spot size, sampling mode, required outputs and whether measurement is offline, inline or during coating. A range or repeatability published for one model must not be applied to another model.
This page limits equipment claims to current product pages and published test conditions. Requirements not listed for a model need separate technical confirmation.
Film Thickness Product and Specification Matrix
| Model | Mode | Measurement | Published range and conditions |
|---|---|---|---|
| SE100 | Offline | Thickness, reflectance, transmittance, n, k, band gap and PL; point sampling | 5–1200 nm; repeatability ≤ ±1%; 10 × 10 to 220 × 220 mm samples; calculation < 10 s |
| SE200 | Offline | Micro-area film thickness, n/k, reflectance spectrum and mapping atlas | 4 nm–450 µm; 1–100 µm spot; repeatability ≤ 0.02 nm; absolute accuracy 0.2% or 1 nm; 4–12 inch wafers |
| SE8000 | Offline | Imaging 3D thickness, multi-layer film metrology and uniformity visualization | Full-range continuous spectrum collection and automatic measurement at preset positions; numerical range not published |
| SE600X | Inline | Thickness, absorption, reflectance, transmittance and PL (band gap, peak intensity, peak position and FWHM) | 5–1200 nm; 10 Hz sampling; 31 measurement points; no sample preparation |
| SE31 | In-situ | Wet-film thickness and reflectance from a slot-die coating head | SDK, Ethernet/power connection and machine start/stop triggers; numerical range not published |
| SE310 | In-situ | Continuous single-spot wet-film thickness and reflectance | 300 nm–20 µm; repeatability < 1%; 15 Hz; 1.5–2 mm spot; working distance < 5 mm |
| SE31-FM | In-situ | Transmission/reflection dual-mode optical-film thickness monitoring | 350–2400 nm; wavelength resolution < 0.2 nm; film-thickness accuracy ±0.1% on standard optical-film systems; PLC integration |
Choose Film Thickness Equipment by Task
5–1200 nm Multi-Parameter Point Measurement
Select SE100 when thickness must be reported together with reflectance, transmittance, n/k, band gap or PL on samples up to 220 × 220 mm.
4 nm–450 µm Micro-Area Measurement
Select SE200 for CCD-positioned micro-area measurement, a 1–100 µm spot, 4–12 inch wafer compatibility and outputs including n/k, reflectance spectrum and mapping atlas.
Imaging 3D and Multi-Layer Visualization
Select SE8000 for imaging-based 3D thickness, multi-layer metrology, uniformity visualization and automatic measurement at preset positions. Confirm the numerical range with TDM.
5–1200 nm Inline Perovskite Measurement
Select SE600X for inline perovskite thickness, absorption, reflectance, transmittance and PL measurements at 10 Hz with 31 measurement points.
Offline, Inline and In-Situ Configurations
Offline
SE100 supports point measurement with multiple optical-property outputs. SE200 supports micro-area measurement over 4 nm–450 µm. SE8000 adds imaging-based 3D thickness and uniformity visualization without a published numerical range.
Inline
SE600X is the product-backed inline thickness platform on this page. It measures perovskite full-stack films over 5–1200 nm at 10 Hz and combines thickness with absorption, T/R and PL.
In-Situ
SE31 and SE310 monitor slot-die wet-film thickness and reflectance from the coating head. SE31-FM provides a separate 350–2400 nm T/R optical-film monitoring route with PLC-ready interfaces.
Applications Published on Product Pages
- SE100: semiconductor, photovoltaic and display scenarios.
- SE200: 4–12 inch wafers and various sheet samples.
- SE600X: inline perovskite full-stack films.
- SE31 / SE310: slot-die wet-film coating process.
- SE31-FM: optical coating processes, semiconductor manufacturing, photovoltaic films and flexible electronics R&D.
Prepare a Film Thickness Measurement Request
Provide the target layer, substrate, minimum and maximum thickness, sample size, required spot size or number of points, required outputs, cycle time and integration interface. These conditions determine whether the closest published configuration is SE100, SE200, SE8000, SE600X or an In-situ model.
Request a technical consultation
Frequently Asked Questions About Film Thickness Measurement
How do TDM products measure film thickness?
The published TDM portfolio uses model-specific optical configurations. SE100 provides point measurement over 5–1200 nm; SE200 provides micro-area optical measurement over 4 nm–450 µm; SE600X provides inline perovskite measurement over 5–1200 nm; SE31 and SE310 monitor slot-die wet films; and SE31-FM provides wide-band transmission/reflection optical-film monitoring.
Which TDM model has the widest published film-thickness range?
SE200 publishes the widest numerical range among the current product pages: 4 nm–450 µm. Its repeatability is ≤0.02 nm, absolute accuracy is 0.2% or 1 nm, and selectable spot size is 1–100 µm.
Which model supports offline point measurement with optical-property outputs?
SE100 measures 5–1200 nm films using point sampling and publishes thickness, reflectance, transmittance, n, k, band gap and PL outputs. Published repeatability is ≤ ±1%, with sample sizes from 10 × 10 to 220 × 220 mm.
Which model measures film thickness inline?
SE600X is the published inline perovskite platform. It covers 5–1200 nm and combines thickness with absorption, reflectance, transmittance and PL outputs at 10 Hz using 31 measurement points.
Which models measure film thickness during coating?
SE31 and SE310 mount on a slot-die coating head for wet-film thickness and reflectance monitoring. SE310 publishes a 300 nm–20 µm range and 15 Hz sampling. SE31-FM is a separate wide-band transmission/reflection optical-film monitor covering 350–2400 nm.
