Pain Points: Limits of Traditional Methods
End-of-line sampling cannot cover 100%; delayed feedback blocks real-time correction and precise defect tracing.
Display Panels
Early Defect Catch Cuts Scrap Cost
Stops defects at source; scrap down; troubleshooting time cut 80%.
Process Consistency Raises Yield
Tighter uniformity control resolves uneven film and lowers defects.
Digital Traceability Boosts Efficiency
Full quality archive raises line efficiency and lowers total cost.
Solution: In-Situ Real-Time Monitoring
Non-contact optical sensing between slot die head and pre-bake enables continuous, non-destructive wet-film inspection in process.
Value: Quality, Cost & Traceability
Millisecond feedback enables instant tuning with zero miss risk; pinpoint defects, cut waste, and raise yield and cost efficiency.
Application Case
In-situ module after the slot die head, linked to MES for millisecond thickness monitoring—stopping coating defects at the source.
Core Technology Principles
Broadband thin-film interferometry captures wet-film optics. Custom hardware and algorithms deliver non-contact, high-precision, real-time monitoring.
Custom Optical Filter
Filters stray light in wet-film optics for high SNR and clean signals.
Compact Short Path
Fits tight line spaces, cuts path loss, boosts vibration immunity.
Micron Micro-Spot
Tiny spot captures local thickness at micron-level resolution.
On-Edge Computing
Local real-time analysis for ms response and closed-loop control.