Thin Film Metrology Systems and Model Comparison
TDM thin film metrology products cover model-specific combinations of thickness, reflectance, transmittance, n/k, band gap, PL and uniformity visualization. This page maps each capability to a published product and specification instead of presenting one generic capability set for every configuration.
What Thin Film Metrology Means on This Site
Thin film metrology is broader than a single thickness value, but the available outputs depend on the instrument. SE100 and SE200 publish optical-property outputs alongside thickness; SE600X combines inline thickness and PL/T&R for perovskite films; SE8000 focuses on imaging-based 3D and uniformity visualization; the In-situ series monitors films during active coating processes.
Only capabilities and numerical claims published for a current product are assigned below. Requirements not listed for a model need separate technical confirmation.
Published Capability-to-Product Matrix
Every row below links a technical capability to a concrete product page and its published test conditions.
| Model | Configuration | Measurement outputs | Published specifications |
|---|---|---|---|
| SE100 | Offline | Thickness, reflectance, transmittance, n, k, band gap and PL; point sampling | 5–1200 nm; repeatability ≤ ±1%; 10 × 10 to 220 × 220 mm samples; calculation < 10 s |
| SE200 | Offline | Micro-area film thickness, n/k, reflectance spectrum and mapping atlas | 4 nm–450 µm; 1–100 µm spot; repeatability ≤ 0.02 nm; absolute accuracy 0.2% or 1 nm; 4–12 inch wafers |
| SE8000 | Offline | Imaging 3D thickness, multi-layer film metrology and uniformity visualization | Full-range continuous spectrum collection and automatic measurement at preset positions; numerical range not published |
| SE600X | Inline | Thickness, absorption, reflectance, transmittance and PL (band gap, peak intensity, peak position and FWHM) | 5–1200 nm; 10 Hz sampling; 31 measurement points; no sample preparation |
| SE31 | In-situ | Wet-film thickness and reflectance from a slot-die coating head | SDK, Ethernet/power connection and machine start/stop triggers; numerical range not published |
| SE310 | In-situ | Continuous single-spot wet-film thickness and reflectance | 300 nm–20 µm; repeatability < 1%; 15 Hz; 1.5–2 mm spot; working distance < 5 mm |
| SE31-FM | In-situ | Transmission/reflection dual-mode optical-film thickness monitoring | 350–2400 nm; wavelength resolution < 0.2 nm; film-thickness accuracy ±0.1% on standard optical-film systems; PLC integration |
Choose a System by Measurement Task
Multi-Parameter Offline Point Measurement
For 5–1200 nm films when the required outputs include thickness, reflectance, transmittance, n, k, band gap and PL. Published sample size is 10 × 10 to 220 × 220 mm, with point sampling and ≤ ±1% repeatability.
Micro-Area and Wide-Range Thickness
For CCD-positioned micro-area measurement with a 1–100 µm spot. It covers 4 nm–450 µm and outputs film thickness, n/k, reflectance spectrum and a mapping atlas for 4–12 inch wafers and sheet samples.
Imaging 3D and Multi-Layer Visualization
For imaging-based 3D thickness, multi-layer film metrology, uniformity visualization and automatic measurement at preset positions. Its public product page does not publish a numerical thickness range.
Inline Perovskite Full-Stack Metrology
For inline thickness, absorption, reflectance, transmittance and PL measurements on perovskite films. Published operation is 10 Hz with 31 measurement points and no sample preparation.
In-Situ Metrology Uses Two Different Product Routes
SE31 and SE310: Slot-Die Wet Films
Both modules measure wet-film thickness and reflectance from the coating head with SDK and machine-trigger integration. SE310 publishes a 300 nm–20 µm range, <1% repeatability and 15 Hz sampling; SE31 does not publish equivalent numerical values.
SE31-FM: Wide-Band Optical Films
SE31-FM uses intelligent transmission/reflection switching over 350–2400 nm. Published interfaces include RS-232/485, TCP/IP, analog output and PLC integration. It is a different configuration from the slot-die wet-film modules.
See the full in-situ film thickness monitoring comparison for installation and selection details.
Information Needed for Model Selection
Send the film stack, substrate, expected thickness range, sample dimensions, required outputs, sampling mode and production environment. TDM can then match the request to a model whose public range and interfaces fit the application, or identify which configuration still requires technical confirmation.
Request a technical consultation
Frequently Asked Questions
What is the difference between thin film metrology and film thickness measurement?
Film thickness measurement reports how thick a film is. Thin film metrology can add other published outputs such as reflectance, transmittance, n/k, band gap, PL or uniformity visualization. The available outputs depend on the selected model; they are not universal across every TDM system.
Which TDM system reports thickness and optical properties together?
SE100 reports thickness, reflectance, transmittance, n, k, band gap and PL for 5–1200 nm films using point sampling. SE200 reports micro-area thickness, n/k, reflectance spectrum and a mapping atlas over a published 4 nm–450 µm range.
Which system supports inline perovskite metrology?
SE600X is the published inline platform for perovskite full-stack films. It reports thickness, absorption, reflectance, transmittance and PL outputs at 10 Hz with 31 measurement points over a 5–1200 nm range.
Which systems support in-situ coating monitoring?
SE31 and SE310 monitor wet-film thickness and reflectance from a slot-die coating head. SE31-FM is a separate wide-band transmission/reflection optical-film monitor covering 350–2400 nm with PLC-ready interfaces.
Can specifications be transferred from one TDM model to another?
No. Measurement range, repeatability, sampling mode, sample format and interfaces are model-specific. Use the linked product page for the selected model and confirm any unpublished configuration with TDM.
