In-line Warpage Measurement Solution for Large-Size Conveyor-Driven Glass Substrates
In perovskite tandem PV and display glass production lines, warpage of large-size substrates directly leads to uneven coating thickness and low packaging yield. To address moving glass samples of 1200 mm × 2400 mm on conveyor belts, TDM Technology presents a phase-deflection-based in-line warpage measurement solution for non-contact production-line inspection.
How phase-deflection warpage measurement works
The system projects high-contrast circular dot patterns onto the glass surface. When glass warps, the reflected circular patterns deform into ellipses with positional offsets. By analyzing ellipse distortion, the system calculates local warpage angles, reconstructs full-field 3D topography, and outputs warpage peak-to-valley (PV) values as well as dioptric power.
Key specifications
| Parameter | Specification |
|---|---|
| Sample dimension | 1200 mm × 2400 mm |
| Warpage measurement accuracy | ≤ ±10 μm |
| Scan cycle | < 60 s |
| Conveyor speed | 0.04–0.06 m/s |
| Spatial resolution | 15–25 mm |
| Warpage measurement range | 0–5 mm (expandable) |
| Dioptric power accuracy | ≤ ±5 mD |
Hardware setup and outputs
The hardware setup includes global-shutter industrial cameras, area light source, projection unit, encoder and industrial PC. Triggered synchronously by the encoder, the system performs parallel image processing and outputs warpage pseudo-color maps, quantitative metrics, and OK/NG judgement results.
The solution has passed principle-verification testing. Customized development is available according to actual production-line conditions. Explore related inline metrology and in-situ monitoring products, or contact TDM for a line-specific configuration.
TDM at PSCO 2026 — European partner engagement
Our European partner attended PSCO 2026, held at STCC in Lausanne, Switzerland, from 23–25 September 2026.
PSCO is a leading conference for perovskite photovoltaics, covering single-junction perovskites, perovskite/silicon tandems, device stability, scalable manufacturing, advanced characterization, machine learning and industrialization.
The conference agenda features topics highly relevant to TDM’s product portfolio, including in-situ photoluminescence, in-situ reflectance spectroscopy, PL imaging, high-throughput characterization, scalable coating and automated fabrication. These align with TDM’s offerings for photoluminescence, spectroscopy, area scanning and in-situ monitoring.
TDM product lineup for perovskite research to mass production
- SE10 portable perovskite PL measurement system
- EL/PL area scanning imaging system — SE60 / SE68
- Hyperspectral area scanning inspection system (SE69)
- Thin film thickness & 3D topography metrology tools — SE100, SE200, SE8000
- In-situ monitoring solutions for slot-die coating, VCD and vacuum deposition — In-Situ series
- On-line inspection systems for the full perovskite production workflow — SE600X, SE200x
Our complete thin-film characterization suite supports perovskite research through to mass production, addressing the conference’s key priorities of in-situ monitoring, high-throughput testing and scalable manufacturing.
PSCO attracts a targeted audience of perovskite researchers, pilot-line teams and industrial players — an ideal platform for TDM to maintain visibility and develop customer relationships across the European market. We will keep engaging with top global perovskite events, delivering advanced thin-film metrology technologies to accelerate perovskite PV industrialization.
Get a line-specific configuration
Tell us your glass size, conveyor speed and OK/NG thresholds — our application engineers will recommend an in-line warpage setup. See inline products, in-situ monitoring, or contact TDM.
Frequently asked questions about in-line glass warpage measurement
Why does glass warpage matter in perovskite and display production?
Warpage of large-size glass substrates causes uneven coating thickness and lower packaging yield. On conveyor-driven lines with 1200 mm × 2400 mm glass, even small out-of-plane deformation can shift film uniformity and downstream bonding or encapsulation quality.
How does phase-deflection warpage measurement work?
The system projects high-contrast circular dot patterns onto the glass. When the surface warps, reflected circles deform into ellipses with positional offsets. Analyzing that distortion yields local warpage angles, full-field 3D topography, peak-to-valley (PV) values and dioptric power — all without contacting the substrate.
What accuracy and cycle time does the solution achieve?
Warpage measurement accuracy is ≤ ±10 μm with a scan cycle under 60 seconds at conveyor speeds of 0.04–0.06 m/s. Spatial resolution is 15–25 mm, the warpage range is 0–5 mm (expandable), and dioptric power accuracy is ≤ ±5 mD.
Can the system be customized for my production line?
Yes. The solution has passed principle-verification testing, and customized development is available for actual line conditions — sample size, conveyor encoding, cycle time and OK/NG criteria. Contact TDM for an application review.
How does this relate to TDM’s presence at PSCO 2026?
TDM’s European partner attended PSCO 2026 in Lausanne (23–25 September 2026), engaging perovskite researchers and industrial teams on in-situ PL, reflectance spectroscopy, area scanning and scalable manufacturing — the same portfolio that supports warpage, thickness and optical metrology from R&D to production.
Related guides and products
- Unseen Battleground in Solar Manufacturing
- In Situ Thin Film Monitoring Guide
- SE69 Hyperspectral One Scan Defect Mapping
- Inline metrology products
- SE10 Portable PL Metrology Instrument
- SE600X Inline Perovskite Metrology
- In-Situ Metrology products
- Contact TDM
